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11h agoNvidia and TSMC deepen AI chip partnership with next-gen packaging technology
Nvidia and Taiwan Semiconductor Manufacturing Co. announced on 8 November 2025 an expanded collaboration using TSMC’s 3D packaging technology to produce the next generation of high-performance AI chips. The approach integrates logic and memory more efficiently to improve power usage and throughput for data centers. Analysts said the partnership could extend both companies’ dominance in AI hardware. Production of test wafers has begun in Taiwan, with commercial output expected mid-2026. Shares of TSMC rose 2.4% in Taipei, while Nvidia gained 1.6% in U.S. premarket trading.
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positive
11h agoNvidia and TSMC deepen AI chip partnership with next-gen packaging technology
Nvidia and Taiwan Semiconductor Manufacturing Co. announced on 8 November 2025 an expanded collaboration using TSMC’s 3D packaging technology to produce the next generation of high-performance AI chips. The approach integrates logic and memory more efficiently to improve power usage and throughput for data centers. Analysts said the partnership could extend both companies’ dominance in AI hardware. Production of test wafers has begun in Taiwan, with commercial output expected mid-2026. Shares of TSMC rose 2.4% in Taipei, while Nvidia gained 1.6% in U.S. premarket trading.
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positive
Nvidia and TSMC deepen AI chip partnership with next-gen packaging technology
about 11 hours ago
1 min read
85 words
Nvidia and TSMC expanded their AI chip partnership using 3D packaging to boost efficiency, with production slated for mid-2026.
Nvidia and Taiwan Semiconductor Manufacturing Co. announced on 8 November 2025 an expanded collaboration using TSMC’s 3D packaging technology to produce the next generation of high-performance AI chips. The approach integrates logic and memory more efficiently to improve power usage and throughput for data centers. Analysts said the partnership could extend both companies’ dominance in AI hardware. Production of test wafers has begun in Taiwan, with commercial output expected mid-2026. Shares of TSMC rose 2.4% in Taipei, while Nvidia gained 1.6% in U.S. premarket trading.
Nvidia and Taiwan Semiconductor Manufacturing Co. announced on 8 November 2025 an expanded collaboration using TSMC’s 3D packaging technology to produce the next generation of high-performance AI chips. The approach integrates logic and memory more efficiently to improve power usage and throughput for data centers. Analysts said the partnership could extend both companies’ dominance in AI hardware. Production of test wafers has begun in Taiwan, with commercial output expected mid-2026. Shares of TSMC rose 2.4% in Taipei, while Nvidia gained 1.6% in U.S. premarket trading.
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semiconductors
ai
semiconductors
nvidia
tsmc
technology
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Nov 5, 2025 • 06:51 IST