Nvidia and TSMC deepen AI chip partnership with next-gen packaging technology

Nvidia and Taiwan Semiconductor Manufacturing Co. announced on 8 November 2025 an expanded collaboration using TSMC’s 3D packaging technology to produce the next generation of high-performance AI chips. The approach integrates logic and memory more efficiently to improve power usage and throughput for data centers. Analysts said the partnership could extend both companies’ dominance in AI hardware. Production of test wafers has begun in Taiwan, with commercial output expected mid-2026. Shares of TSMC rose 2.4% in Taipei, while Nvidia gained 1.6% in U.S. premarket trading.