STMicroelectronics invests $60M in French PLP pilot amid semiconductor restructuring
STMicroelectronics has committed $60 million toward a pilot line in its Tours, France factory to adopt Panel-Level Packaging (PLP) technology, part of its broader restructuring effort. The investment involves reorganizing older manufacturing lines and relocating some operations to enhance efficiency. PLP allows chips to be produced on large square panels rather than conventional circular wafers, cutting manufacturing steps and boosting throughput. The pilot line is expected operational by third quarter of 2026, amid global push for more automated, cost-efficient chip production.
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29 days ago
STMicroelectronics invests $60M in French PLP pilot amid semiconductor restructuring
STMicroelectronics has committed $60 million toward a pilot line in its Tours, France factory to adopt Panel-Level Packaging (PLP) technology, part of its broader restructuring effort. The investment involves reorganizing older manufacturing lines and relocating some operations to enhance efficiency. PLP allows chips to be produced on large square panels rather than conventional circular wafers, cutting manufacturing steps and boosting throughput. The pilot line is expected operational by third quarter of 2026, amid global push for more automated, cost-efficient chip production.
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STMicroelectronics invests $60M in French PLP pilot amid semiconductor restructuring
30 days ago
1 min read
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STMicroelectronics’s new PLP pilot line in France targets efficiency gains and modernizing production.
STMicroelectronics has committed $60 million toward a pilot line in its Tours, France factory to adopt Panel-Level Packaging (PLP) technology, part of its broader restructuring effort. The investment involves reorganizing older manufacturing lines and relocating some operations to enhance efficiency. PLP allows chips to be produced on large square panels rather than conventional circular wafers, cutting manufacturing steps and boosting throughput. The pilot line is expected operational by third quarter of 2026, amid global push for more automated, cost-efficient chip production.
STMicroelectronics has committed $60 million toward a pilot line in its Tours, France factory to adopt Panel-Level Packaging (PLP) technology, part of its broader restructuring effort. The investment involves reorganizing older manufacturing lines and relocating some operations to enhance efficiency. PLP allows chips to be produced on large square panels rather than conventional circular wafers, cutting manufacturing steps and boosting throughput. The pilot line is expected operational by third quarter of 2026, amid global push for more automated, cost-efficient chip production.